Technology Overview Material Sets

Corporate Manufacturing Capabilities

AttributesStandardAdvancedDevelopment (NPI Only)
Panel Sizes12 x 18, 18 x 24, 21 x 2420 x 2622 x 28
Layer Counts2 – 2830 – 3840 +
Flex Layer Counts2 – 68 – 1012+
Rigid Flex Layer Counts4 – 1416 – 2426 +
Cavity Sizes1.0″ x 1.0″.750″ x .750″< .500″ x .500″
Laminates – Materials
Pb Free RoHs – 180 Tg FR4YesYesYes
Med Loss – FR408 HR, -13EPYesYesYes
Low Loss – 13EPSI, I-SpeedYesYesYes
Ultra Low Loss – Meg 6, I-TeraYesYesYes
PolyimideYesYesYes
Rogers LaminatesYesYesYes
Flex – Dupont APYesYesYes
Flex – Dupont LFYesYesYes
Flex – Dupont FRYesYesYes
Halogen FreeYesYesYes
Imaged Trace / Space / Pad
Internal Line Width.003″.002″.0015″
Internal Spacing.003″.002″.0015″
External Line Width.003″.002″.0015″
External Spacing.003″.002″.0015″
Minimum Pad.015″.010″.008″
Impedance Tolerance10%5%<5%
SMT Pitch.010″.008″.006″
VIA – PTH Tolerances
Smallest Drilled Via.0079″.005″.004″
Aspect Ratio10:114:118:1
Minimum Cu Clearance to Hole.008″.006″.004″
PTH Tolerance [+/-].003″.002″.0015″
NPTH Tolerance.001″.001″.001″
Back Drill Depth Tolerance.005″.003″.002″
HDI Capabilities
Sequential Lamination3x Lam Cycles5x Lam Cycles7x Lam Cycles
Laser Micro Vias.0045″.003″.003″
Blind Aspect Ratio.75:11:11.2:1
Blind/Buried Vias.004″.003″.003″
Via in PadEpoxy or Copper Filled––
Laser Routing Board Thickness<.040″.040″ – .062″.062″ +
Solder Mask-Nomenclature
Taiyo LPIGreen, Blue, RedBlack, WhiteAll Colors
Minimum Clearance.003″.002″.001″
Minimum Web.004″.003″.002″
Legend ColorWhiteBlack, Yellow, OrangeAll Colors
Test & Measurement
Flying Probe TestYesYesYes
Fixture TestYesYesYes
TDRYesYesYes
IonicsYesYesYes
CMI XRFYesYesYes

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