Attributes Standard Advanced Development (NPI Only)
Panel Sizes 12 x 18, 18 x 24, 21 x 24 20 x 26 22 x 28
Layer Counts 2 – 28 30 – 38 40 +
Flex Layer Counts 2 – 6 8 – 10 12+
Rigid Flex Layer Counts 4 – 14 16 – 24 26 +
Cavity Sizes 1.0″ x 1.0″ .750″ x .750″ < .500″ x .500″
Laminates – Materials
Pb Free RoHs – 180 Tg FR4 Yes Yes Yes
Med Loss – FR408 HR, -13EP Yes Yes Yes
Low Loss – 13EPSI, I-Speed Yes Yes Yes
Ultra Low Loss – Meg 6, I-Tera Yes Yes Yes
Polyimide Yes Yes Yes
Rogers Laminates Yes Yes Yes
Flex – Dupont AP Yes Yes Yes
Flex – Dupont LF Yes Yes Yes
Flex – Dupont FR Yes Yes Yes
Halogen Free Yes Yes Yes
Imaged Trace / Space / Pad
Internal Line Width .003″ .002″ .0015″
Internal Spacing .003″ .002″ .0015″
External Line Width .003″ .002″ .0015″
External Spacing .003″ .002″ .0015″
Minimum Pad .015″ .010″ .008″
Impedance Tolerance 10% 5% <5%
SMT Pitch .010″ .008″ .006″
VIA – PTH Tolerances
Smallest Drilled Via .0079″ .005″ .004″
Aspect Ratio 10:1 14:1 18:1
Minimum Cu Clearance to Hole .008″ .006″ .004″
PTH Tolerance [+/-] .003″ .002″ .0015″
NPTH Tolerance .001″ .001″ .001″
Back Drill Depth Tolerance .005″ .003″ .002″
HDI Capabilities
Sequential Lamination 3x Lam Cycles 5x Lam Cycles 7x Lam Cycles
Laser Micro Vias .0045″ .003″ .003″
Blind Aspect Ratio .75:1 1:1 1.2:1
Blind/Buried Vias .004″ .003″ .003″
Via in Pad Epoxy or Copper Filled
Laser Routing Board Thickness <.040″ .040″ – .062″ .062″ +
Solder Mask-Nomenclature
Taiyo LPI Green, Blue, Red Black, White All Colors
Minimum Clearance .003″ .002″ .001″
Minimum Web .004″ .003″ .002″
Legend Color White Black, Yellow, Orange All Colors
Test & Measurement
Flying Probe Test Yes Yes Yes
Fixture Test Yes Yes Yes
TDR Yes Yes Yes
Ionics Yes Yes Yes
CMI XRF Yes Yes Yes

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