Complex Technology Printed Circuit Board Key Benefits

Consumer demands for complex technology PCBs in San Jose along with technologic innovations and trends change often.  Now designers can place additional parts on both sides of the raw PCB, by utilizing HDI technology. Moreover, multiple via processes, such as blind via and in pad via options, provide more PCB area to connect elements, making them smaller and closer together. Component size and modified pitch in smaller geometries support more I/O. This suggests a significant reduction in signal loss and crossing delays and faster transmission of signals.

Cost-Effective HDI

Even with the majority of consumer products decreasing in size, quality and affordability remain the two most important factors for consumers. By employing HDI technology during the configuration process, it is conceivable to reduce an eight-layer through-hole PCB to a four-layer, HDI micro via technology board! The wiring capabilities of a well-designed HDI four-layer PCB can achieve equal or better functions than that of a standard eight-layer PCB. Other practical functions include:

  1. Significant reduction in crossing delays
  2. Place components closer together
  3. More I/O in smaller geometries
  4. Faster signal transmission

Although the microvia process increases the price of the HDI PCB, the reduction in layer count and a well-defined design reduces costs significantly in material square inches and number of layers.

HDI PCB Manufacturing

Successful manufacturing of HDI PCBs requires specialized methods and tools, such as sequential lamination cycles, plugging, laser drills, and laser direct imaging. High-density interconnect (HDI) technology enables board planners to reduce layer count, enhance the electrical and thermal characteristics of their PCB designs, and increase routing density.

This strategy utilizes advanced via technology. For example, an 18-layer HDI card can be manufactured by combining two standard eight-layer cards, creating a product that is 50 percent smaller. The boards either share a redesigned power supply or use individual ones. APCT’s facility uses the latest in technology equipment to produce this advanced HDI PCB.