Trends in Complex Technology PCB

The trend in complex technology PCB in Silicon Valley is towards more extensive composites. Many boards have significantly more solder joints and components than even just a few years ago. A higher number of elements typically means more cost for each PCB, resulting in tremendous work in process and scrap costs. Greater complexity, lower yields, and diagnosing difficulties usually lead to the occurrence of failures. Today’s smaller components are also increasing the challenge to place them correctly on the PCB. To stay competitive, test and inspection strategies need to address these trends.

Complex PCB Capabilities

Changing consumer demands motivate evolving technology. Utilizing HDI technology enables designers to install added elements on either side of a new PCB. Multiple via processes, including blind and via-in-pad technology, allow designers more geometries to install components that are smaller and closer together. In addition to designing for manufacturability and testability, hand- and auto-routing, and manufacturing support, complex, high-density design capabilities of complex PCB include:

  • Single-sided, double-sided, and multilayer boards
  • Matched length and controlled impedance traces
  • High-speed digital, analog, mixed, and RF designs
  • SMT, through-hole, and mixed-technology
  • Ground, power, split, and isolated planes
  • Complex physical design rule checking

Complex technology PCB circuit boards employ the technology-pushing capabilities of blind and buried vias to drive applications in a significant number of industries, such as semiconductor test equipment, defense, aerospace, and medical.

Building Complex PCBs

A complex technology printed circuit board manufacturer utilizes proper equipment and material to create thinner lines, smaller annular rings, and tighter spacing. A significant investment in manufacturing processes and additional time is required to produce this type of board successfully.

APCT has completed numerous complex PCB projects successfully. Decades of experience, unrestricted utilization of validation tools, and reputation enable us to generate high-quality purposes for complex, low-risk systems. We have an active product improvement method for ensuring that devices meet all of the design criteria and exceed customer expectations.