The value of quality high density interconnect technology for Silicon Valley innovators is unparalleled, and that’s why many of the area’s top technology companies rely on APCT for their HDI PCBs. Our experienced team specializes in a wide range of PCB designs, including stacked or buried vias, sequential lamination, and 50-75 micron spacing in order to provide the best variety to meet our various customers’ needs. Technology is constantly advancing, and in order to match it, we encourage an environment of “best in class” practices and constant improvement.
High density interconnect PCB technology is used in everything from touch screen tablets to 4G smartphones, and these devices and many more are constantly being improved by Silicon Valley companies and individuals. Whether you’re an independent engineer or a large-scale business, you need a reliable partner that operates with skill, speed, and responsiveness. At APCT, we are proud to be an industry leader in cycle times for HDI specific designs — our average is 2-5 days, along with a 10-day standard lead time. This level of timeliness is essential in a field of continual development and innovation, and our team goes the extra mile to ensure our rigid PCBs are crafted with precision and the latest in high-performance materials. Furthermore, we are dedicated to offering our clientele the best available engineering support from passionate people who believe in advancement.
Our high density interconnect PCB products are created right here in our Santa Clara factory, located in the heart of Silicon Valley. When you work with us, you’ll always rest assured you have a dedicated partner for all your rigid PCB needs. Reach out to one of our project engineers today with any questions!