As a guideline, APCT offers the following:

PCB Description APCT Standard Production Cycle Times In Days  
    4-Layer 6L 8L 10L 12L 14L 16L 18L 20L 22L 24L 26L 28L
Conventional Multilayer Build-up                            
  APCT Standard 10 10 10 10 10 10 10 10 10 10 10 10 10
Conventional Multilayer Build-up w-Via Fill                            
  APCT Standard 10 10 10 10 10 10 10 10 10 10 10 10 10
Conventional Build-up with Blind Via’s & Via Fill                            
Laser – CDD – Back Drill APCT Standard 12 12 12 12 12 12 12 12 12 12 12 12 12
Sequential Build-up N+N (2 subs) (2 x press)                            
  APCT Standard 15 15 15 15 15 15 15 15 15 15 15 15 15
1+N+1 (2 Layer Buried Sub 1x press)                            
  APCT Standard 10 10 10 10 10 10 10 10 10 10 10 10 10
1+N+1 (M/L Buried Sub (2x press)                            
  APCT Standard 15 15 15 15 15 15 15 15 15 15 15 15 15
2+N+2 (1 Buried Sub (2x press)                            
  APCT Standard 15 15 15 15 15 15 15 15 15 15 15 15 15
2+N+2 (2 Buried sub (3x press)                            
  APCT Standard 15 15 15 15 15 15 15 15 15 15 15 15 15
3+N+3 (3 Buried Sub (3x press)                            
  APCT Standard 15 15 15 15 15 15 15 15 15 15 15 15 15
4+N+4 (3 Buried Sub (4x press)                            
  APCT Standard 20 20 20 20 20 20 20 20 20 20 20 20 20
Anylayer (Full Stacked Micovia)                            
  APCT Standard 20 20 20 20 20 20 20 20 20 20 20 20 20