As a guideline, APCT offers the following:

PCB DescriptionAPCT Standard Production Cycle Times In Days 
  4-Layer6L8L10L12L14L16L18L20L22L24L26L28L
Conventional Multilayer Build-up              
 APCT Standard10101010101010101010101010
Conventional Multilayer Build-up w-Via Fill              
 APCT Standard10101010101010101010101010
Conventional Build-up with Blind Via’s & Via Fill              
Laser – CDD – Back DrillAPCT Standard12121212121212121212121212
Sequential Build-up N+N (2 subs) (2 x press)              
 APCT Standard15151515151515151515151515
1+N+1 (2 Layer Buried Sub 1x press)              
 APCT Standard10101010101010101010101010
1+N+1 (M/L Buried Sub (2x press)              
 APCT Standard15151515151515151515151515
2+N+2 (1 Buried Sub (2x press)              
 APCT Standard15151515151515151515151515
2+N+2 (2 Buried sub (3x press)              
 APCT Standard15151515151515151515151515
3+N+3 (3 Buried Sub (3x press)              
 APCT Standard15151515151515151515151515
4+N+4 (3 Buried Sub (4x press)              
 APCT Standard20202020202020202020202020
Anylayer (Full Stacked Micovia)              
 APCT Standard20202020202020202020202020